Silicone Thermally Conductive Encapsulant

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Silicone thermally conductive encapsulant.

Two part 1 1 1 hr 40 24 hrs 30 min 60 c 1 58 45 1 8 85 24 ul 94 v 0 dowsil cn 8760 thermally conductive encapsulant even higher flow version of dowsil cn 8760 g encapsulant dark gray 2 700. They also provide protection from harsh environments vibration and thermal shock. Home thermally conductive silcool tia208r thermally conductive silicone encapsulant. Lord cooltherm sc 324 thermally conductive silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical electronic encapsulating applications while retaining desirable properties associated with silicones.

Dowsil cn 8760 thermally conductive encapsulant please contact dow for distribution options available for this product. Thermally conductive silicones from dow come in a wide range of viscosities cure speeds and delivery systems to meet the growing need for improved thermal management in electronics designs for virtually every industry. Thermally conductive encapsulant designed for fast fill rates and reworkability with moderate thermal conductivity gray 3 200 addition cure. Fast cure 2 component room temperature curable thermally conductive potting material.

The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry. Silco therm thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. Thermally conductive silicone adhesives momentive performance materials developed its family of silcool thermally conductive adhesives to help deliver thin bond lines which contribute to low thermal resistance while providing excellent adhesion and reliability. Tia208r has the unique benefit of providing primerless adhesion when cured at both elevated heat or at room temperature to not only metallic substrates but to also.

Lord cooltherm sc 6703 thermally conductive silicone encapsulant is a two component system designed to provide thermal conductivity for encapsulating densely packed power units.